Summary: TSMC unveiled new technology for faster chips and larger, more powerful chip packages, including a 15% speed boost for processors and a “System on Wafer-X” capable of integrating at least 16 large computing chips. The company plans to build two factories near its Arizona chip plants to support this new technology. Intel, TSMC’s main competitor, is expected to announce new manufacturing technologies next week.

Link: https://www.straitstimes.com/business/companies-markets/tsmc-shows-off-new-tech-for-stitching-together-bigger-faster-chips