Back 10 Jul 2025

Singapore has the opportunity to become a global hub for advanced chip packaging: study ​  

Summary: Singapore is well-positioned to become a global hub for advanced chip packaging, leveraging its existing semiconductor industry and addressing gaps in AI and robotics-enabled manufacturing. The government remains optimistic about the semiconductor industry and global trends like AI and next-generation wireless communications.

Link: https://www.businesstimes.com.sg/singapore/singapore-has-opportunity-become-global-hub-advanced-chip-packaging-study