Skylink Holdings Limited has announced the successful completion of its S$5.0 million Hire Purchase Bond issuance, which was fully subscribed, marking a significant milestone in the Group's strategy to accelerate the expansion of its fast-growing Credit Business.

The two-year, unlisted, non-convertible and non-transferable bonds carry an annual coupon rate of 8.0%, payable semi-annually. The net proceeds will be deployed to expand the Group's hire purchase loan book through organic growth and/or potential M&A opportunities.

Key highlights:

- Strong loan book growth: Expanded from S$24.16 million in FY2023 to S$66.24 million in FY2026, representing a compound annual growth rate of approximately 40%.

- Potential expansion beyond S$100 million: The bond issuance could support at least S$30 million in additional loan book growth, potentially increasing the Group's loan book to more than S$100 million across FY2027 and FY2028.

- Disciplined credit management: Maintained a non-performing loan ratio below 0.5% and a delinquency ratio below 2% in FY2026, with zero defaults across its banking relationships since business inception.

- Non-dilutive funding: Provides additional financial flexibility to scale the Group's income-generating loan portfolio while preserving existing shareholders' equity interests.

The successful issuance strengthens Skylink's financial capacity to pursue growth opportunities within its integrated commercial vehicle ecosystem, supporting the financing and mobility requirements of a broader SME customer base.

See link for full media release: https://www.skylink-ir.com/view&id=85